贴片电感外观检查标准

贴片电感外观检查标准

1.1 装配工序:- 1.1.1 磁芯装歪 (Core skewed) --------------------------------------------- 1.1.2 底座溢胶 (Extra glue on base)------------------------------------ 

1.2 绕线工序: 1.3.1 磁芯破(Core broken )--------------------------------------------------- 

1.3 剪线尾工序:

1.3.2 缠线方向错 (Wrong wrapping orientation) ------------------------ 

1.3.3 线松 (Wire loose)-------------------------------------------------------- 

1.3.4 排线不平整 (not even winding)---------------------------- ---------- 

1.3.5 线伤 (Wire damaged)--------------------------------------- ------------ 

1.3.6 线打结 (wire knot)---------------------------------- --------------------- 

1.3.7 线包大 (winding big)------ ----------------------------------------------

 1.3.8 线不入槽 (wrapping wire not in slot)--------------------------------- 

 1.4.1 缠线圈数不足 (Less looping)------------------------------------------ 

 1.4.2 线尾翘 (End wire raised)---------------------------------------------- 

1.4.4 线尾长 (pig tail long)---------------------------------------------------- 

1.4.5 线伤 (Wire damaged)----------------------------------------------------

 1.4.6 线不入槽 (wrapping wire not in slot)---------------------------------- 

 1.4 浸锡工序:

 1.5.1 锡珠锡渣(Solder ball or residue) ------------------------------------- 

1.5.2 针脚有锡尖 (Tin tine on pin)-------------------------------------------

 1.5.3 焊盘粘锡 (Tin on pad)---------------------------------------------------

 1.5.4 上锡不足 (Soldering insufficient)-------------------------------------- 

1.5.5 焊片堆锡 (Tin on pad)--------------------------------------------------- 

1.5.6 引线回烧 (lead wire burn)---------------------------------------------- 

1.5 清洗工序: 

 1.6.1 焊片脏(Dirty pad)--------------------------------------------------------- 

1.6 包胶工序: 1.7.1 包胶不良(tape short) ---------------------------------------------------- 1.7.2 包胶翘(tape raised)-------------------------------------------------------