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基于PCB板的射频声表滤波器封装技术研究
资料介绍
目前主流的终端用射频声表面波（RF-SAW）滤波器均采用基于低温共烧陶瓷（LTCC）基板的倒装焊接技术，标准尺寸为单滤波器1．4mm×1．1mm，封装形式为芯片尺寸级封装（CSP）。介绍了一种基于印刷电路板（PCB）的CSP封装声表面波滤波器，其尺寸达到了1．4mm×1．1mm。使用该基板后，单个器件的材料成本将降低30％以上。通过优化基板的结构，可以达到与LiTaO。匹配的热膨胀系数（CTE）和较低的吸湿性。经后期的可靠性试验证明，该结构的射频滤波器可完全满足工程应用的需求。
The mainstream packaging for RF-SAW filters in the terminals are mainly used the flip chip technolo- gy based on LTCC ceramic board. The packaged standard size is 1.4 minx 1.1 mm for single SAW filter CSP. This paper introduces a CSP SAW filter based on multilayer print circuit board （PCB）, and the size goes down to 1.4 mm × 1.1 mm. With the usage of PCB board, the cost of single device will be cut more than 30%. Through optimizing the board structure, the coefficient of thermal expansion （CTE） of PCB board can match with that of its counterpart LiTaOa and the moisture absorption is low. The post~reliability test result shows that the RF-SAW filter with the proposed structure can meet the requiremen...
部分文件列表
| 文件名 | 大小 |
| 基于PCB板的射频声表滤波器封装技术研究.pdf | 540K |
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