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PCB设计中同步开关噪声问题分析
资料介绍
印刷电路板设计中的同步开关噪声问题是现代高速数字电路应用的瓶颈之一。介绍了一种在电路板上施加同步开关报文和温度应力的可靠性测试方法,该方法可以有效暴露电路板上的同步开关噪声问题。借助噪声测试和阻抗分析手段,对一个由该方法发现的异常问题进行了分析,通过优化去耦电容和电源平面阻抗,抑制了电路板上的同步开关噪声,问题得到了完美解决。最后,给出了一些在PCB设计中抑制同步开关噪声的方法和建议。
In the application of modem high - speed digital circuits, one of the bottlenecks is the simultaneous switching noise in printed circuit board（PCB） design. A reliability test method applying simultaneous switching message and temperature stress to circuit board is introduced in this paper. With this method the simultaneous switching noise problem in circuit board can be effectively exposed. By means of the noise test and impedance analysis, an abnormal problem discovered by the method is analysed. Through optimization of the decoupling ca- pacitor and the power supply impedance, the simultaneous switching noise is suppressed in the circuit board, and the problem is solved perfectly. Finally, some methods and suggestions for suppressing simultane...
部分文件列表
| 文件名 | 大小 |
| PCB设计中同步开关噪声问题分析.pdf | 364K |
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