混合集成电路用Pb-Sn-Sb-Ag钎料的热疲劳

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为了解决混合集成电路中环境温度变化引发的焊点可靠性问题,开发了具有高可靠性的新型钎料来满足微型化和高密度化的混合集成电路的焊接需要.对新研发的Pb-Sn-Sb-Ag四元合金钎料进行了DSC熔点测试,热电偶测试了回流焊的温度曲线,对焊点显微组织进行了相分析,并参照IPC-9701A测试方法进行了热循环实验,结果发现热循环前后钎料的显微组织和力学性能发生了明显的变化.研究表明：钎料合金液相点在245℃;回流焊峰值温度为267℃;显微组织中主要有Pb、Sb2Sn3和Ag3Sn三种相;热失配产生的剪切应力导致了微裂纹产生,温度交变使裂纹持续扩展,最终导致焊点出现了整体剥离的断裂失效模式;金属间化合物厚度和剪切强度呈现逐渐递减的近似线性关系;对比已应用的钎料,新研制的Pb-Sn-Sb-Ag钎料显微组织均匀,在-40~150℃热循环条件下表现出高的可靠性.

To solve the problem of the reliability of solder joints caused by changes of ambient temperature in a hybrid integraed circuit, a new type of solder with high reliability was developed to meet the welding requirements of the miniaturization and high-density hybrid integrated circuit. Melting point test, reflow profile, phase analysis and thermal cycle test were conducted under the reference of IPC-9701 A on the newly developed Pb-Sn-Sb-Ag solder and the fact that the microstructure and mechanical properties of solder joints changed significant before and after ther...