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紫外光激光加工盲孔的工艺研究
资料介绍
紫外光（UV）激光因波长短、能量大、加工精度高等优点,被越来越多地应用到PCB微孔制作工艺中。文章研究了UV激光加工φ200μm的盲孔,通过正交试验分析了激光功率、加工速度、激光频率和Z轴高度等各因素与钻孔深度之间的关系,且获得了UV激光制作一阶与二阶盲孔的最佳工艺参数和方法。研究结果表明,钻孔深度随着激光功率和加工速度的增大而增大,而激光频率的增加使钻孔深度减小。
UV laser is potential to apply in PCB micro via in advantages of short wavelength,huge energy and high processing accuracy.In this paper,UV laser was studied on drilling the blind hole with diameter at 200μm. Relationship between drilling depth and factors such as laser power,processing speed,laser frequency and the height of z-axis were analyzed by orthogonal experiment.Optimum processing parameters and methods of drilling first-order and second-order blind holes with UV laser were also achieved.Research results show that the drilling depth is deeper with the increase of laser power and processing speed,but lower when laser frequency raises.
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| 文件名 | 大小 |
| 紫外光激光加工盲孔的工艺研究.pdf | 300K |
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