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印制电路板批量性孔无铜问题的探讨
资料介绍
孔无铜是造成印制电路板产品报废的常见缺陷之一,具有功能性影响。文章利用切片显微方法、万孔实验、正交试验法,结合PCB孔金属化流程,研究了PCB出现批量性孔无铜的原因,提出了一些改善措施,并通过效果追踪验证了改善措施的可行性。
Having no copper in the holes is one of the common defects that results in scrap of the PCB and the functional infl uences. In this paper, the cause of having no copper in the holes in batches of the PCB was studied by using the microscope slice method and by the thousands of holes test and the orthogonal experiment, and combining the process of hole metallization of PCB. Some improvements were then put forward and confi rmed by a tracking study.
部分文件列表
| 文件名 | 大小 |
| 印制电路板批量性孔无铜问题的探讨.pdf | 1M |
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