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基于ESPI的集成电路封装热特性研究
资料介绍
为了快速有效地测试和分析集成电路封装的热特性,本文以激光电子散斑干涉术(ESPI)为测量手段,在分析了集成电路热学结构模型的基础上,建立了离面位移的响应方程。选用大规模的集成电路CPU486为实验对象,并以动态老化的方式实现了实验样品的功率加载,通过电子散斑干涉方法得到了离面位移的响应曲线,并对其处理得到了热阻-热容关系曲线。实验结果与相关文献数据吻合,表明利用电子散斑测量集成电路封装的热特性是可行性的。
To quickly and effectively measure and analysis thermal characteristics of IC, Measurement method based on ESPI(electronic speckle pattern interferometer) is proposed in this paper, off-surface response function is established by analysis thermal structure model of IC Package. Taking VLSI CPU486 for experimental, power loading is implemented by dynamic burn-in mode, Off-surface response curve is obtained by the electronic speckle pattern interferometry(ESPI), curve of thermal resistance-thermal capacity is extracted by further processing of Off-surface response curve. Experimental results are agreement with the data of reference document closely, which demonstrates feasibility of proposed method.
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基于ESPI的集成电路封装热特性研究.pdf | 237K |
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