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废弃电路板SMD元件热拆除工艺实验研究
资料介绍
废弃电路板元件的分离,一直是废弃电路板回收利用的难点。利用有限元分析软件ANSYS建立表面安装元器件（SMD）的有限元分析模型,通过对加热过程进行仿真,分析出元件分离的必要条件。
Component separation has been the difficulty for waste PCB recycling. In this paper, the finite element analysis software ANSYS was used to establish the finite element analysis model of the surface mount components （SMD）, by which the heating process was simulated, and the necessary conditions for components separation were given.
部分文件列表
| 文件名 | 大小 |
| 废弃电路板SMD元件热拆除工艺实验研究.pdf | 1M |
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