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基于编码结构光视觉的印刷电路板焊点检测系统设计
资料介绍
针对现行自动光学检测系统精度低、成本高的问题,设计了一套基于编码结构光视觉的电路板焊点检测系统。利用Gray码的离散、容错率高等特征,结合相移以克服相位模糊的缺点,消除了边缘扩散对条纹边缘定位的影响。创新设计焊点的定位方法,利用三维坐标提取高度差异的优势,将焊点的定位转换为阴影边缘的定位获取。试验表明:该方法能有效地将电路板重构最大误差降至0.82 mm,耗时5 413 ms,满足实时和精度的要求。通过试验对比,论证了投射Gray码与相移图案比单纯采用Gray码精度更高,能够更好地体现焊点细节,实现焊点的精确定位与检测。基于编码结构光视觉的电路板焊点检测,在提高系统可靠性的同时,能有效缩减成本,可推广应用于激光测距、合成孔径雷达等涉及相位测量的领域。
In order to solve the problem of low precision and high cost of the current automatic optical inspection system,a PCB solder joint inspection system based on structured light vision is designed.By using the features of Gray code discretization and high fault tolerance,and combining with phase shift to overcome the shortcomings of phase ambiguity,the influence of edge diffusion on the edge positioning of stripe is eliminated.The innovative positioning method of solder joints is used to extract the advantages of height difference by using three-dimensional coordinates.The positioning of the solder joint is converted to the positioning of the shadow edge.The test shows that the method effectively reduces the maximum error of board reconstruction to 0.82 mm;time consuming 5 413 ms,which satisfies the requirements of accuracy and real-time performance.The test comparison demonstrates that the method of projected Gray code and phase shift pattern are more accurate than the one with Gray code alone,and better reflect solder joint details,to realize accurate positioning and inspection of solder joints.The circuit board solder joint inspection system based on coded structured light vision improves the system reliability and realizes effective cost reduction.It can be applied to many fields involving phase measurement such as laser ranging and synthetic aperture radar.
部分文件列表
| 文件名 | 大小 |
| 基于编码结构光视觉的印刷电路板焊点检测系统设计.pdf | 2M |
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