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Cree XLamp XP-L LEDs灯珠规格书

更新时间：2020-01-03 17:13:54 大小：3M 上传用户：牧歌田园查看TA发布的资源 标签：LED灯珠 下载积分：1分 评价赚积分 （如何评价?） 打赏 收藏 评论(0) 举报

资料介绍

CREE XPL灯珠规格书  里面有所有的关于灯珠的详细参数

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CREE_XPL.pdf 3M

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Product family data sheet  
Cree® XLamp® XP-L LEDs  
XP-L High Density LED  
XP-L High Intensity LED  
PꢀoDuCꢁ DEꢂCꢀIPꢁIoꢃ  
FEAꢁuꢀEꢂ  
ꢁAbLE oF CoꢃꢁEꢃꢁꢂ  
XLamp® XP-L LeDs arꢀ aꢁailablꢀ in two  
ꢁꢀrsions: High Dꢀnsity and High Intꢀnsity.  
•
Aꢁailablꢀ in whitꢀ, 70-CRI whitꢀ, 80-CRI Charactꢀristics............................................2  
whitꢀ, 85 CRI whitꢀ and 90-CRI whitꢀ  
ANSI-compatiblꢀ chromaticity bins  
Binned at 85 °C  
Flux Charactꢀristics - XP-L High Dꢀnsity...3  
Flux Charactꢀristics - XP-L High Intꢀnsity .8  
Rꢀlatiꢁꢀ Spꢀctral Powꢀr Distribution ...... 12  
Relative Flux vs. Junction Temperature.. 12  
elꢀctrical Charactꢀristics......................... 13  
Rꢀlatiꢁꢀ Flux ꢁs. Currꢀnt .......................... 13  
Rꢀlatiꢁꢀ Chromaticity ꢁs. Currꢀnt............ 14  
Rꢀlatiꢁꢀ Chromaticity ꢁs. Tꢀmpꢀraturꢀ... 15  
Typical Spatial Distribution...................... 16  
•
•
•
•
•
Thꢀ XLamp XP-L High Dꢀnsity (HD) LeD  
is thꢀ highꢀst pꢀrforming discrꢀtꢀ in  
Crꢀꢀ’s High Dꢀnsity (HD) class of LeDs,  
dꢀliꢁꢀring thꢀ nꢀxt gꢀnꢀration of lumꢀn  
output and efficacy in the compact  
Maximum drive current: 3000 mA  
Low thermal resistance: 2.2 °C/W  
Wide viewing angle: 125° (XP-L High  
Density), 115° (XP-L High Intensity)  
Unlimited floor life at  
3.45 mm  
x
3.45 mm XP footprint.  
•
Crꢀꢀ’s HD LeDs, optimizꢀd to dꢀliꢁꢀr  
maximum lumꢀn output in a small form  
factor, ꢀnablꢀ lighting manufacturꢀrs  
to improꢁꢀ thꢀ pꢀrformancꢀ of any  
lighting dꢀsign, crꢀatꢀ smallꢀr and lꢀss  
ꢀxpꢀnsiꢁꢀ systꢀms, and dꢀꢁꢀlop nꢀw  
lighting solutions that wꢀrꢀ prꢀꢁiously  
not possiblꢀ.  
≤ 30 ºC/85% RH  
•
•
•
•
Reflow solderable - JEDEC J-STD-020C Thꢀrmal Dꢀsign........................................ 16  
elꢀctrically nꢀutral thꢀrmal path  
Pꢀrformancꢀ Groups – Luminous Flux... 17  
Pꢀrformancꢀ Groups – Chromaticity...... 18  
Crꢀꢀ’s Standard Chromaticity Rꢀgions  
Plottꢀd on thꢀ 1931 CIe Curꢁꢀ ................ 21  
Cree’s Standard Cool White Kits Plotted  
on ANSI Standard Chromaticity  
RoHS and ReACh compliant  
UL® rꢀcognizꢀd componꢀnt (e349212)  
Rꢀgions..................................................... 23  
Cree’s Standard Warm and Neutral  
Thꢀ XLamp XP-L High Intꢀnsity (HI) LeD  
is the first of Cree’s new class of High  
Intꢀnsity (HI) LeDs optimizꢀd to dꢀliꢁꢀr  
maximum candꢀla through sꢀcondary  
optics. Built on Crꢀꢀ’s brꢀakthrough SC5  
Tꢀchnology® Platform, thꢀ XP-L HI LeD  
dꢀliꢁꢀrs 120 pꢀrcꢀnt morꢀ candꢀla than  
thꢀ XP-L HD LeD through thꢀ samꢀ optic.  
Thꢀ XP-L HI LeD lꢀꢁꢀragꢀs thꢀ industry’s  
highꢀst singlꢀ-diꢀ pꢀrformancꢀ and a  
nꢀw innoꢁatiꢁꢀ primary optic dꢀsign that  
radically rꢀducꢀs thꢀ optical sourcꢀ sizꢀ  
to dꢀliꢁꢀr both lumꢀns and intꢀnsity.  
White Kits Plotted on ANSI Standard  
Chromaticity Rꢀgions .............................. 24  
Cree’s Standard Chromaticity Kits .......... 26  
Bin and Ordꢀr Codꢀ Formats................... 27  
Reflow Soldering Characteristics............ 28  
Notꢀs ........................................................ 29  
Mꢀchanical Dimꢀnsions .......................... 31  
Tapꢀ and Rꢀꢀl........................................... 33  
Packaging................................................. 35  
Copyright © 2014-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo,  
XLamp® and SC5 Technology® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. Other trademarks,  
product, and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship  
or association.  
Cree, Inc.  
4600 Silicon Drive  
Durham, NC 27703  
USA Tel: +1.919.313.5300  
XLamp® Xp-L LED  
CHAꢀACꢁEꢀIꢂꢁICꢂ  
Characteristics  
unit  
Minimꢄm  
ꢁypical  
Maximꢄm  
Thꢀrmal rꢀsistancꢀ, junction to soldꢀr point  
Viewing angle (FWHM) - XP-L High Density  
Viewing angle (FWHM) - XP-L High Intensity  
Temperature coefficient of voltage  
eSD withstand ꢁoltagꢀ (HBM pꢀr Mil-Std-883D)  
DC forward currꢀnt  
°C/W  
dꢀgrꢀꢀs  
dꢀgrꢀꢀs  
mV/°C  
v
2.2  
125  
115  
-2  
8000  
3000  
-5  
mA  
Rꢀꢁꢀrsꢀ ꢁoltagꢀ  
v
Forward voltage (@ 1050 mA, 85 °C)  
LeD junction tꢀmpꢀraturꢀ  
v
2.95  
3.25  
150  
°C  
Copyright © 2014-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and SC5 Technology® are registered trademarks  
of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. Other trademarks, product, and company names are the property of their respective owners and do not imply specific product and/or  
vendor endorsement, sponsorship or association.  
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