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多层PCB大面积敷铜通孔焊点过锡工艺研究
资料介绍
针对生产过程中出现的焊点过锡量不足的现象,对多层PCB板大面积敷铜手工焊接中通孔焊点过锡问题进行试验研究,得出两层以下覆铜层的通孔焊点采用单把烙铁焊接,两层及以上覆铜层的通孔焊点采用两把烙铁焊接的方法.
This paper first analyzes the reason of the defect of fluid solder point in hand soldering.A research of through-hole soldering was carried on,and a process method is introduced.Finally,the problem about the insufficient solder joint was solved by the method of using one brand irons in less than two copper overlaid and two brand irons to solder the through-hole in multi copper overlaid.
部分文件列表
| 文件名 | 大小 |
| 多层PCB大面积敷铜通孔焊点过锡工艺研究.pdf | 636K |
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