高端服务器类印制电路板的技术发展趋势和挑战

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高端服务器所用到的PCB多由美国和日本的厂商所制造,近年来,随着中国大陆/中国香港/中国台湾PCB厂商技术和工艺能力的提高,和成本的优势;部分高度服务器的PCB开始逐渐往大中华区PCB厂商转移。面对此趋势,我们国内的PCB商家需了解此类PCB的技术发展趋势和面临的挑战,积极提升技术和流程能力以赢得更多的定单。此论文将介绍高端服务器类PCB面对无铅焊接,高频应用和高可靠性的要求,其技术发展的趋势,以及对PCB制造商技术能力的要求和挑战。

Almost all the High end server PCBs were fabricated by the PCB shop at USA and Japan in the past.Recently,some of them start to purchase from the PCB shops at great China areas along with the technology and process capability grown up/mature,and the cost advantage in these area.Especially after year 2008,this trend is expedited.Our domestic PCB shops shall well understand the requirements,technology trend and gap of their current capability,then,develop their technology and process capability to fulfill the gap and gain the business.This technical paper introduces the high end server PCB technology trend to fulfill the lead free assembly/high frequency and high reliability requirements,and the challenge to PCB shops.