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EMC设计详细讲解

更新时间：2019-09-11 19:12:45 大小：2M 上传用户：+vx15059162534查看TA发布的资源 标签：emcemiesdEFT浪涌设计 下载积分：5分 评价赚积分 （如何评价?） 打赏 收藏 评论(0) 举报

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很实用的一篇文档

介绍了ESD,EMI,EMC,EFT的设计考虑。

文中截取一部分来说明：

当你的设计有两个地时：

一个是AC Earth大地，一个是信号地，、

中间通过阻容连接的设计，两地之间的间隙要留多少？

阻容怎么选择？

阻容的作用？

当你的设计只有一个信号地时：

PCB怎么设计？

多点接地，单点接地，如何接地？

静电如何泄放？





部分文件列表

文件名 大小
EMC详细讲解.pdf 2M

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部分页面预览

（完整内容请下载后查看）
AN2587  
EMI, EMC, EFT, and ESD Circuit Design Consideration for  
32-bit Microcontrollers  
Introduction  
This application note is intended to provide recommendations concerning incorporation of circuit  
protection devices and PCB layout guidelines to enhance an application's immunity in electrically noisy  
environments and survivability of EMI, EMC, EFT, and ESD events as described in the International  
Electrotechnical Commission (IEC) standards: IEC 61000-4-2, IEC 61000-4-4, and IEC 61000-4-5.  
We will begin with:  
1. A brief review of EMI, EFT, and ESD specifications.  
2. Key ESD protection device specifications definitions.  
3. A quick summary of EMI, EFT, and ESD protection strategies.  
4. Capacitor filter selection and characteristics.  
5. PCB Hardware design best practices and layout considerations checklists:  
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–
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Standard PCB design/layout practices  
Special Ethernet layout considerations  
Special DDR Layout considerations  
6. Software protection techniques.  
7. Microcontroller reference circuit schematics with protection examples:  
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RS-232  
USB  
CAN FD and LIN  
Ethernet  
Audio and mechanical switches  
LCD  
Power supplies  
Reset and ICSP programming interface  
SD memory card  
I2C  
Reference Designs Note:  
Cost pressure is a constant consideration in any design. All of the circuit components in support of the  
CPU were selected based on the lowest cost and availability, which met the threat protection  
requirements. A user should carefully consider any substitutions. It is also highly recommended that the  
user consider designing in the protection elements in their layout, and then depopulate with zero ohm  
resistors as they think necessary, based on ESD, EMI, and EFT prototype board testing. This will save  
significant board redesign time to market in the final product.  
DS00002587A-page 1  
© 2017 Microchip Technology Inc.  

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