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Cree XLamp XHP50.2 LEDs 规格书

更新时间：2020-01-03 17:14:22 大小：2M 上传用户：牧歌田园查看TA发布的资源 标签：LED 下载积分：2分 评价赚积分 （如何评价?） 打赏 收藏 评论(0) 举报

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CREE-XHP502.pdf 2M

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PRODUCT FAMILY DATA SHEET  
Cree® XLamp® XHP50.2 LEDs  
PRODUCT DESCRIPTION  
FEATURES  
TABLE OF CONTENTS  
The XLamp XHP50.2 LED is the next  
generation of Extreme High Power LEDs  
that delivers the lowest system cost  
through the best lumen density, reliability  
and color consistency. Built on Cree’s  
latest high-power LED technology, the  
XHP50.2 LED improves the lumen density,  
voltage characteristics, reliability and  
optical performance of the XHP50 LED in  
the same 5.0 mm x 5.0 mm footprint. The  
new XHP50.2 LED provides an easy drop-in  
upgrade to achieve higher system LPW  
for lighting manufacturers with existing  
XHP50 designs, eliminating redesign costs.  
Its unparalleled lumen density and longer  
lifetime at higher operating temperatures  
also enables new and innovative lighting  
designs at lower system costs.  
•
Available in white, configurable to  
Characteristics..............................................2  
Flux Characteristics, EasyWhite® Order  
Codes and Bins .............................................3  
Flux Characteristics, ANSI White Order  
Codes and Bins .............................................5  
3 V, 6 V or 12 V by PCB layout  
•
Available in 5-step EasyWhite® bins  
at 3000 K to 5000 K CCT, 3-step  
EasyWhite bins at 2700 K to 5000 K  
and 2-step EasyWhite bins at 2700 K Relative Spectral Power Distribution ...........8  
to 4000 K CCT  
Relative Flux vs. Junction Temperature.......8  
Electrical Characteristics..............................9  
Relative Flux vs. Current ............................ 10  
Relative Chromaticity vs Current............... 12  
Relative Chromaticity vs Temperature...... 13  
Typical Spatial Distribution........................ 14  
Thermal Design.......................................... 14  
•
•
Available in ANSI white bins at  
3000 K to 7000 K CCT  
Available in standard, 70-, 80-, and  
90-minimum CRI options  
Binned at 85 °C  
•
•
Maximum drive current: 6000 mA  
(3 V), 3000 mA (6 V), 1500 mA (12 V) Performance Groups – Luminous Flux..... 16  
•
•
•
Low thermal resistance: 1.2 °C/W  
Wide viewing angle: 120°  
Unlimited floor life at  
≤ 30 ºC/85% RH  
Performance Groups – Chromaticity........ 16  
Cree’s EasyWhite® Chromaticity Regions  
Plotted on the 1931 CIE Curve .................. 19  
Cree’s ANSI Cool White Kits Plotted on  
•
Reflow solderable - JEDEC  
J-STD-020C  
ANSI Standard Chromaticity Regions....... 20  
Cree’s ANSI Warm and Neutral White Kits  
Plotted on ANSI Standard Chromaticity  
•
•
RoHS and REACh compliant  
UL® recognized component  
(E349212)  
Regions....................................................... 21  
Bin and Order Code Formats..................... 22  
Reflow Soldering Characteristics.............. 23  
Notes .......................................................... 24  
Mechanical Dimensions ............................ 26  
Electrical Configuration ............................. 27  
Tape and Reel............................................. 28  
Packaging................................................... 29  
Copyright © 2016-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo,  
XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.  
Cree, Inc.  
4600 Silicon Drive  
Durham, NC 27703  
USA Tel: +1.919.313.5300  
XLAMP® XHP50.2 LED  
CHARACTERISTICS  
XHP50.2 LEDs are tested and binned in production in the 12-V configuration. See the Mechanical Dimensions section on page 26 for  
pad layout options.  
Characteristics  
Unit  
Minimum  
Typical  
Maximum  
Thermal resistance, junction to solder point  
Viewing angle (FWHM)  
°C/W  
degrees  
mV/°C  
mV/°C  
mV/°C  
V
1.2  
120  
-1.5  
-3  
Temperature coefficient of voltage (3 V)*  
Temperature coefficient of voltage (6 V)*  
Temperature coefficient of voltage (12 V)  
ESD withstand voltage (HBM per Mil-Std-883D)  
DC forward current (3 V)*  
-6  
8000  
6000  
3000  
1500  
5
DC forward current (6 V)*  
mA  
mA  
V
DC forward current (12 V)  
Reverse voltage  
Forward voltage (3 V, @ 2800 mA, 85 °C)*  
Forward voltage (6 V, @ 1400 mA, 85 °C)*  
Forward voltage (12 V, @ 700 mA, 85 °C)  
LED junction temperature  
V
2.8  
5.6  
3.1  
V
6.2  
V
11.2  
12.4  
150  
°C  
Note:  
*
Data for the 3-V and 6-V configurations are calculated and for reference only.  
Copyright © 2016-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree,  
Inc. UL® and the UR logo are registered trademarks of UL LLC.  
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