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平面埋入电容的印制电路板研究
资料介绍
文章介绍以有机/无机复合薄膜作为电介质层的埋入式平面电容,其结构为金属-介质-金属,其具有与印制电路板制造工艺的良好兼容性,采用层压法进行平面埋入式电容的制作,其工艺简单,制作成本较低,可实现大规模量产。
This paper describes organic/inorganic composite film as dielectric layer capacitance of the submerged plane. Its structure is metal-dielectric-metal, it has good compatibility with printed circuit board manufacturing technology using lamination method for plane embedded capacitor production, the process is simple, production cost is lower, thus mass production can be realized.
部分文件列表
| 文件名 | 大小 |
| 平面埋入电容的印制电路板研究.pdf | 642K |
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