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超薄化技术在HDI印制电路板中的应用研究
资料介绍
文章主要讲述在高阶HDI印制电路板制作过程中涉及到的几类超薄化技术的应用，包括超薄芯板、超薄粘结片、超薄面铜等制作新技术，对其加工难点的解决方案进行解析和探讨，并针对后续超薄化技术的发展趋势提出了展望。
In this article, it mainly told about several kinds of ultra-thin technology application in high steps HDI PCB manufacturing, including the ultra-thin core, ultra-thin prepreg, ultra-thin copper foil and other new technology. It makes analysis and discussion on the solution of the processing difficulty, and the prospects for future research are put forward.
部分文件列表
| 文件名 | 大小 |
| 超薄化技术在HDI印制电路板中的应用研究.pdf | 4M |
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