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基于GDS的数字集成电路电磁场模型提取方法
资料介绍
提出了一种建模方法,可以根据电路设计文档为集成电路复杂的互连结构建立三维电磁场模型。针对数字或混合工艺的1Px M集成电路,以电路的GDS版图为原始材料,利用制程工艺文件中的几何和物理信息,还原出芯片的完整三维结构,在ANSYS Q3D中建立芯片的电磁场模型。使用此建模方法,可以使对芯片进行精确的高频电磁分析变得方便,并使集成电路设计平台与ANSYS分析平台得以更好的结合,为集成电路电磁兼容仿真开辟了另一种可行的途径。
A modeling method which can establish a 3D electromagnetic field model for the complex interconnect structure for integrated circuits according to circuit design documents is given. In the light of digital or hybrid technology 1Px M integrated circuits, the GDS domains of the circuits are used as the raw material. Using geometry and physical information in the process file, the 3D structure of the chip is able to be restored, so that the electromagnetic field model can be established in ANSYS Q3 D. Using this modeling method, it is convenient to analyze the high frequency electromagnetic field precisely and make better combination between integrated circuit design platform and ANSYS analysis platform. It provides a feasible way ...
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| 文件名 | 大小 |
| 基于GDS的数字集成电路电磁场模型提取方法.pdf | 2M |
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