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DFN和QFN封装板级应用手册（英文版）
资料介绍
Various ON Semiconductor components are packaged in
an advanced Dual or Quad Flal-Pack No-Lead package
(DFN/QFN).The DFN/QFN platform represents the latest
in surface moumt packaging technology,it is important that
the desigm of the Mcounting Pads of the Printed Circuit Board
(PCB）,Soldermask and Stencil palterm,along with the
assembly process,all follow the suggested guidelines
outlined in this document.
部分文件列表
| 文件名 | 大小 |
| DFN和QFN封装板级应用手册.pdf | 75K |
全部评论(1)
2019-04-16 13:35:52yuia
确实 很有用！！