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Ceramic Ball Grid Array packaging,Assembly
大小:2M 更新时间:2018-01-15 下载积分:2分
Outline for DiscussionWhy BGA??CBGA Introduction and Package DescriptionPC Board Design for CBGACBGA AssemblyReworkBoard-Level Solder Joint Reliability
大小:2M 更新时间:2018-01-15 下载积分:2分
Outline for DiscussionWhy BGA??CBGA Introduction and Package DescriptionPC Board Design for CBGACBGA AssemblyReworkBoard-Level Solder Joint Reliability