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清华大学半导体封装技术课件
大小:3M 更新时间:2021-03-11 下载积分:9分
传统集成电路,封装的成本相对较低;但是在某些器件中,封装成本已接近器件成本的1/2;在MEMS/微系统中,封装可能比芯片制造更加困难,成本可能上升为70%~90%;封装已经成为新器件商业化的瓶颈
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JESD22-B110A 标准文件
大小:76K 更新时间:2021-03-10 下载积分:8分
TEST METHOD B110SUBASSEMBLY MECHNICAL SHOCK(From JEDEC Board Ballot JCB-04-71, formulated under the cognizance of the JC-14.1 Subcommittee onReliability Test Methods for Packaged Devices.)
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jesd22A105C
大小:38K 更新时间:2021-03-10 下载积分:5分
TEST METHOD A105-BPOWER AND TEMPERATURE CYCLING(From JEDEC Board Ballot JCB-03-70, formulated under the cognizance of the JC-14.1Subcommittee on Reliability Test Methods for packaged Devices.)
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jesd22A104D
大小:158K 更新时间:2021-03-10 下载积分:5分
TEST METHOD A104DTEMPERATURE CYCLING(From Board Ballot JCB-00-16, JCB-05-82, and JCB-09-20, formulated under the cognizance ofthe JC-14.1 Committee on Reliability Test Methods for Packaged Devices.)
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jesd22a103c
大小:77K 更新时间:2021-03-10 下载积分:5分
TEST METHOD A103CHIGH TEMPERATURE STORAGE LIFE(From JEDEC Board Ballot JCB-04-96, formulated under the cognizance of JC-14.1Subcommittee on Reliability Test Methods for Packaged Devices.)