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一种适于RFID标签生产的多路温度控制方案

更新时间:2020-09-10 20:05:09 大小:577K 上传用户:xiaohei1810查看TA发布的资源 浏览次数:20 下载积分:2分 VIP全场五折 评价赚积分 (如何评价?) 标签:rfid温度控制 收藏 评论(0) 举报

资料介绍

针对RFID标签生产ACA热压固化模块,设计了一套多路温度控制系统方案.硬件上以C 8051F020单片机为核心,针对硬件电路的各功能模块,包括温度采集电路、加热驱动电路、单片机电路等进行了设计.同时在软件上,进行了温度数据采集以及滤波算法的实现,并采用积分分离式PID控制加热模块.经温度试验表明,系统具有高精度和良好的稳定性;同时移植于RFID标签生产设备,进行批量生产典型UHF标签9662的实验数据表明,标签产品良品率达到99.85%以上,一致性与稳定性满足要求,适于标签的批量生产.

A new multi-channel temperature control scheme applicable to ACA nmltipoint is introduced. MCU C8051F020 is designed as the core. The hardware circuit, mainly including temperature acquisition circuit, heating driver circuit and microcon- troller circuit, is also designed. At the same time, the data acquisition and filtering algorithm of software are realized, using integral separated PID to control heating module. The temperature test show that the system has high precision and good stability. Product rate of typical UHF tags 9662 above 99.85%, the consistency and stability meet the requirements. The scheme is suitable to apply to ACA multipoint curing process in RFID chip packaging.

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一种适于RFID标签生产的多路温度控制方案.pdf 577K

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