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MT2625 datasheet v1.2
资料介绍
MT2625 Datasheet
Version: 1.2
Release date: 31 January 2018
NB-IoT transceiver
• Compliant with 3GPP R13/R14 NB-IoT standard
• Supports DL 200kHz bandwidth/UL single tone and multi-tone
• Supported RF bands: B1/B2/B3/B5/B8/B11/B12/B13/B17/B18/B19/B20/B21/B25/B26/B28/B31/B66/B70/B71
• Supports PSM and eDRX mode
Microcontroller subsystem
• ARM® Cortex®-M4 with FPU and MPU
• 14 DMA channels
• One RTC timer, one 64-bit and five 32-bit general purpose timers
• Development support: SWD, JTAG
• Crypto engine
o AES 128, 192, 256 bits
o DES, 3DES
o MD5, SHA-1, 224, 256, 384, 512
• True random number generator
• JTAG password protection
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Version:
1.2
Release date: 31 January 2018
© 2015 - 2018 MediaTek Inc.
This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s). MediaTek cannot grant you
permission for any material that is owned by third parties. You may only use or reproduce this document if you have agreed to and been
bound by the applicable license agreement with MediaTek (“License Agreement”) and been granted explicit permission within the License
Agreement (“Permitted User”). If you are not a Permitted User, please cease any access or use of this document immediately. Any
unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited. THIS DOCUMENT IS PROVIDED ON AN
“AS-IS” BASIS ONLY. MEDIATEK EXPRESSLY DISCLAIMS ANY AND ALL WARRANTIES OF ANY KIND AND SHALL IN NO EVENT BE LIABLE FOR ANY
CLAIMS RELATING TO OR ARISING OUT OF THIS DOCUMENT OR ANY USE OR INABILITY TO USE THEREOF. Specifications contained herein are
subject to change without notice.
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MediaTek MT2625 Datasheet
Document Revision History
Revision
1.0
Date
Description
18 January 2018
29 January 2018
31 January 2018
Initial release
1.1
Update Features, Figure1.2-1, Figure5.5-2, Table6.1-2, Table6.2-1, Ch7.2
Update Table2.5-2, Table4.3-1
1.2
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MediaTek MT2625 Datasheet
Features
NB-IoT transceiver
• Three I2C (3.4Mbps) interfaces
• Four UART interfaces (3Mbps, UART1/2 with
hardware flow control)
• Two SPI masters and one SPI slave
• Two I2S interfaces
• Compliant with 3GPP R13/R14 NB-IoT standard
• Supports DL 200kHz bandwidth/UL single tone
and multi-tone
• Supported RF bands:
o
One 16/24-bit, master/slave mode;
One 16-bit, master/slave mode with TDM
Both support 16, 24, 48, 96, 192kHz and
11.025kHz, 22.05kHz, 44.1kHz, TX/RX, 2
channels
B1/B2/B3/B5/B8/B11/B12/B13/B17/B18/B19/B20
/B21/B25/B26/B28/B31/B66/B70/B71
o
•
Supports PSM and eDRX mode
Microcontroller subsystem
• Four PWM channels
• 37 GPIOs (5V-tolerant)
• ARM® Cortex®-M4 with FPU and MPU
• 14 DMA channels
• Seven IOs for BPI and MIPI interfaces
• Three IOs for SIM
• One RTC timer, one 64-bit and five 32-bit general
purpose timers
• 5 channel 10-bit AUXADC (PinMux with GPIO),
maximum input voltage 1.4V
• Embedded thermal sensor
• Development support: SWD, JTAG
• Crypto engine
o
o
o
AES 128, 192, 256 bits
DES, 3DES
MD5, SHA-1, 224, 256, 384, 512
Power management
• Three integrated high efficiency buck converters
with low quiescent current
• Four integrated LDO regulators for RTC, SIM, RF
frontend and GPIOs
• True random number generator
• JTAG password protection
Memory
• Operating temperature from -40°C to 85°C
• Up to 32KB SYSRAM, with zero-wait state
• Up to 32KB L1 cache, with high hit rate and zero-
wait state
Clock source
• 26MHz crystal oscillator
• 32kHz crystal oscillator or internal 32kHz
oscillator for RTC
• Embedded 32Mbits flash
o
Sleep current 200nA
• Embedded 32Mbits pseudo SRAM
Sleep current 10µA
o
Package
Communication interfaces
• 5.6-mm x 5.6-mm x 1.05-mm TFBGA with 0.5-mm
ball pitch
• Two SDIO 2.0 masters and one SDIO 2.0 slave
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MediaTek MT2625 Datasheet
Table of Contents
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Page 1 of 85
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MediaTek MT2625 Datasheet
Lists of Tables and Figures
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Page 2 of 85
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MediaTek MT2625 Datasheet
1. System Overview
MediaTek MT2625 is a highly integrated chipset featuring an application processor, a low power multiband
narrowband Internet of Things transceiver and a power management unit (PMU).
MT2625 is based on ARM® Cortex®-M4 with floating point microcontroller unit (MCU) integrated with 4MB PSRAM
and 4MB flash memory. MT2625 also supports interfaces including UART, I2C, SPI, I2S, PWM, SDIO, ADC, USB,
keypad and USIM.
The NB-IoT transceiver contains the 3GPP R13/R14 radio, baseband and MAC that are designed to meet low power
and extended battery life application requirements.
MT2625X product family
Table 1.1-1. Difference between all product series chipsets
Item
MT2625D series
MT2625A series
Product Number
Package size
Package ball, pitch
SiP flash size
SiP PSRAM size
MT2625DA
MT2625DPA
MT2625AA
MT2625APA
5.6-mm x 5.6-mm x 1.05-mm
121-ball, 0.5mm pitch
32Mbits
5.6-mm x 5.6-mm x 1.05-mm
121-ball, 0.5mm pitch
N/A
32Mbits
32Mbits
ARM® Cortex®-M4
operation frequency
78 MHz
39 MHz
78MHz
156 MHz
78 MHz
78 MHz
39 MHz
78MHz
156 MHz
78 MHz
PSRAM operation
frequency
Flash operation
frequency
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MediaTek MT2625 Datasheet
System architecture
SPI master *2
SPI slave
FPU
NVIC
MPU
NB-IoT
Transceiver
ARM® Cortex®-M4
104 MHz
SDIO master
*2
RF
Subsystem
SDIO slave
I2S *2
Cache
Modem
SYSRAM
Baseband
I2C *3
TCM
Modem
SPM
UART *4
AUXADC
EINT
DMA
SPM
Timer 0
Timer 1
Timer 2
Timer 3
Timer 4
Timer 5
2.1V~
3.63 V
PWM *4
Keypad 3 × 3
USB
Power
Management
Unit
GPT
TRNG
Crypto Engine
USIM
Dynamic Clock Management
RTC
UPLL/MPLL
XPLL
SFC
EMI
DCXO
XOSC
32 kHz
MT2625DA,
MT2625DPA
only
PSRAM
MT2625AA,
MT2625APA
only
XTAL
32.768
kHz
XTAL
26 MHz
Figure 1.2-1. MT2625 chipset architecture
Platform features overview
1.3.1.
Host processor subsystem
•
•
•
ARM® Cortex®-M4 with FPU application processor
32kB L1 cache with high hit rate and zero wait state
eXecute In Place (XIP) on flash memory
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MediaTek MT2625 Datasheet
1.3.2.
Memory
•
•
SiP 32Mb low power flash memory with 0.2µA deep-down current (typical condition)
SiP 32Mb low power PSRAM with 10µA half-sleep mode current
(current condition: PASR 1/8 at 25°C 1x refresh)
•
32kB SYSRAM with zero wait state
1.3.3.
Peripheral interfaces
The following interfaces are multiplexed with GPIO.
•
•
•
•
•
•
•
Two SPI master interface, 1, 2, 4-bit mode, up to 52MHz
One SPI slave interface, 1, 2, 4-bit mode, up to 52MHz
Two SDIO host interface (v2.0)
One SDIO device interface (v2.0)
One USB interface (v1.1)
3x3 keypad
Two I2S interface supporting 16 or 24-bit, master or slave mode
(supports 16, 24, 48, 96, 192, 11.025, 22.05 and 44.1kHz sample rates, transmit and receive, two
channels)
•
•
•
•
Up to four UART interfaces, UART1/2 with hardware flow control (~3Mbps)
Up to three I2C master interfaces (3.4Mbps)
Up to five channels of 10-bit ADC
Up to four PWM channels
Table 1.3-1. MT2625 series peripherals
Peripheral
Keypad
PWM
UART
USB
Counts
Description
3x3 keypad scanner
with double key detection
4
-
up to 3Mbps, UART1/2 support RTS/CTS
4
v1.1, require external LDO for USB
1
master mode, 400kbps, Up to 3.4Mbp
I2C
3
I2S
2 master/slave
2 master
-
v2.0, up to 52MHz, 1-bit/4-bit mode
eMMC4.41 , no booting and not support DDR mode
v2.0, up to 52MHz, external host booting via SDIO
MSDC
SDIO
SPI
1 slave
2 master
1 slave
clock up to 52MHz, 1-bit/2-bit/4-bit
clock up to 52MHz, 1-bit/2-bit/4-bit, external host booting
via SPI
SPI
SIM
1
no support 3V SIM if non-chargeable battery
10-bit ADC, pin mux by AGPIO
AUXADC
GPIO
5-channel
37
all pins with interrupt except GPIO0
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MediaTek MT2625 Datasheet
1.3.4.
Security
•
•
Crypto engine that supports AES, DES/3DES, MD5, SHA1/SHA2
True random number generator
1.3.5.
Others
•
Up to 37 GPIO interfaces with 5V-tolerant fast IOs, each IO can be configured as an external interrupt
source
•
•
27 DMA channels
Single RTC timer, one 64-bit and five 32-bit general purpose timers (GPTs)
Modem features overview
•
•
•
•
•
Compliant to 3GPP 36.101 R13/R14 category NB1/NB2
Supported bands include EUTRA 1, 2, 3, 5, 8, 12, 13, 17, 18, 19, 20, 25, 26, 28, 66 and 70.
Optional bands are EUTRA 11, 21, 31, and 71.
Low power 1.3-V single-ended Saw-Less RX and Polar TX.
Built-in low dropout linear regulators that are powered by switching regulator
Power management unit (PMU) features overview
•
•
•
Wider input voltage range 2.1V to 3.63V
Four Low Drop-out Regulators (LDOs) and three high efficiency buck converters
Contains Under-Voltage Lockout (UVLO) circuit and a reference band-gap circuit
Package
•
For MT2625, a TFBGA of 5.6mm*5.6mm, 121-ball, 0.5mm pitch package is offered.
© 2015 - 2018 MediaTek Inc.
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MediaTek MT2625 Datasheet
2. Functional Description
Host processor subsystem
2.1.1.
ARM® Cortex®-M4 with FPU
The Cortex-M4 with FPU is a low-power processor with 3-stage pipeline Harvard architecture. It has reduced pin
count and low power consumption and delivers very high performance efficiency and low interrupt latency,
making it ideal for embedded microcontroller products.
The processor incorporates:
•
•
•
•
IEEE754-compliant single-precision floating-point computation unit (FPU).
A Nested Vectored Interrupt Controller (NVIC) to achieve low latency interrupt processing.
Enhanced system debugging with extensive breakpoint.
An optional Memory Protection Unit (MPU) to ensure platform security robustness.
The Cortex-M4 executes the Thumb®-2 instruction set with 32-bit architecture, with the high code density of 8-bit
and 16-bit microcontrollers. The instruction set is fully backward compatible with Cortex-M3/M0+.
MT2625 has further enhanced the Cortex-M4 with FPU to reduce the power by another 11% (in Dhrystone)
compared to the original Cortex-M4. Low power consumption is a significant feature for IoT and Wearables
application development.
2.1.2.
Cache controller
A configurable 32kB cache is implemented to improve the code fetch performance when CPU accesses a non-zero
wait-state memory such as EMI, external flash or boot ROM through the on-chip bus.
The core cache is a small block of memory containing a copy of a small portion of cacheable data in the external
memory. If CPU reads a cacheable datum, the datum will be copied to the core cache. Once CPU requests the same
datum again, it can be obtained directly from the core cache (called cache hit) instead of fetching it again from the
external memory to achieve zero wait-state latency.
The cache can be disabled and this block of memory can be turned into tightly coupled memory (TCM), a high-
speed memory for normal data storage. The sizes of TCM and cache can be set to one of the following four
configurations:
•
•
•
•
32kB cache, 64kB TCM
16kB cache, 80kB TCM
8kB cache, 88kB TCM
0kB cache, 96kB TCM
2.1.3.
Memory management
Three types of memories are implemented for use:
•
•
•
On-die memories (SRAMs) with up to 32kB at CPU clock speed with zero wait state.
Embedded flash of 32Mbits to store programs and data
Embedded pseudo SRAM (PSRAM) of 32Mbits for application storage
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MediaTek MT2625 Datasheet
The SRAMs are composed of TCMs and L1 caches. The L1 cache (up to 32kB) is implemented to improve processor
access performance of the long latency memories (flash and PSRAM).
TCMs are designed for applications requiring high speed, low latency and low power consumption. Each TCM has
its own power state; active, retention or power-down. TCM must be in active state for normal read and write
access. Retention state saves the SRAM content and consumes the minimum leakage current with no access.
Power-down state loses the content and consumes almost zero power.
The TCMs can also be accessed by other internal AHB masters like DMA or multimedia subsystem for low power
applications. These applications can run on TCM without powering on PSRAM or flash to save more power.
Boot ROM is also implemented for processor boot–up and its content is unchangeable.
2.1.4.
Memory protection unit (MPU)
The MPU is an optional component to manage the CPU access to memory. The MPU provides full support for:
•
•
•
•
Protection regions (up to 8 regions and can be further divided up into 8 sub-regions).
Overlapping protection regions, with region priority.
Access permissions.
Exporting memory attributes to the system.
The MPU is useful for applications where a critical code has to be protected against misbehavior of other tasks. It
can be used to define access rules, enforce privilege rules and separate processes.
2.1.5.
Nested Vectored Interrupt Controller (NVIC)
The NVIC supports up to 76 maskable interrupts and 16 interrupt lines of Cortex-M4 with 128 priority levels. The
NVIC and the processor core interface are closely coupled to enable low latency interrupt processing and efficient
processing of late arriving interrupts. The NVIC maintains knowledge of the stacked or nested interrupts to enable
tail-chaining of interrupts. The processor supports both level and pulse interrupts with programmable active-high
or low control.
2.1.6.
External Interrupt Controller
The external interrupt controller consists of up to 32 edge/level detectors for generating event/interrupt requests.
Each input line can be independently configured to select the type (interrupt or event) and the corresponding
trigger event (rising edge or falling edge or both or level). Each line can also be masked independently. A pending
register maintains the status line of the interrupt requests. Up to 37 GPIOs can be connected to 23 external
interrupt lines.
Platform description
2.2.1.
Boot mode
• Internal or external booting device, flow control
There are three boot source options:
•
•
•
Serial flash
SPI slave (to load binary from host)
SDIO slave (to load binary from host)
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MediaTek MT2625 Datasheet
The host may transmit a binary through SPI slave or SDIO slave to internal SRAM. The MCU (Cortex-M4) can
execute on internal SRAM after transmission is complete.
The boot source in boot ROM is determined according to the flowchart shown in IF_EN and HIF_SEL
can be configured at power up using BPI_2 and BPI_3, respectively.
N
HIF_EN = 1?
Y
N
HIF_SEL = 1?
Y
Boot from SDIO slave
Boot from SPI slave
Boot from Serial flash
Figure 2.2-1. Boot source flow
2.2.2.
Trapping and mode selection
Mode selection
Pin
name
Description
Trapping
condition
32kHz clock source BPI1
select
GND
: 32kHz source is from external (default)
Power-on
reset
DVDD_IO_1 : 32kHz source is from internal (divided from
26MHz clock)
Boot with host
interface (HIF_EN)
BPI2
BPI3
GND
DVDD_IO_1 : Boot with host interface enabled
GND : Host interface via SPI slave (default, HIF_SEL
must keep GND level, if HIF_EN is “GND”)
DVDD_IO_1 : Host interface via SDIO slave
: Boot with host interface disabled (default)
Power-on
reset
Host interface
select (HIF_SEL)
(active if HIF_EN is
enabled)
Power-on
reset
System Level Test
(SLT) mode
BPI4
GND
: Normal mode (default)
Power-on
reset
DVDD_IO_1 : SLT mode
USB download
GPIO0
GND
: Enter USB download mode in Boot ROM
Power-on
reset or
system reset
DVDD_IO_2 : No USB download in Boot ROM (default)
Note 1: Strapping resistors for default option are implemented as internal pull-down or internal pull-up 47kΩ.
Note 2: If non-default option is used, it is recommended to use pull-down or pull-up 10kΩ as external strapping
resistors.
Note 3: HIF_SEL must keep GND level, if HIF_EN is “GND”.
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MediaTek MT2625 Datasheet
2.2.3.
General Purpose Timer (GPT)
The GPT includes five 32-bit timers and one 64-bit timer. Each timer has four operation modes; ONE-SHOT,
REPEAT, freerun with interrupt (FREERUN_I), and FREERUN, and can operate on one of the two clock sources; RTC
clock (32.768kHz) and system clock (13MHz).
2.2.4.
Interrupt controller
The NVIC supports up to 76 maskable interrupts and 16 interrupt lines of Cortex-M4 with 128 priority levels. The
NVIC and the processor core interface are closely coupled to enable low latency interrupt processing and efficient
processing of late arriving interrupts. The NVIC maintains knowledge of the stacked or nested interrupts to enable
tail-chaining of interrupts. The processor supports both level and pulse interrupts with programmable active-high
or low control.
2.2.5.
Real-time clock (RTC)
The RTC module provides time and data information, as well as 32.768kHz clock source. The clock is selected
between three clock sources — one from an external (XOSC32) and two from an internal (XO, EOSC32). The RTC
block has an independent power supply switch. In addition to providing timing data, an alarm interrupt will be
generated and can be used to power up the baseband core. Regulator interrupts corresponding to seconds,
minutes, hours and days can be generated whenever the time counter value reaches the maximum value. The year
span is supported up until 2,127. The maximum day-of-month values, which depend on the leap year condition,
are stored in the RTC block.
Peripheral description
2.3.1.
USB1.1 full-speed device controller
The USB11 device controller supports only full-speed (12Mbps) operation. The USB11 device controller provides six
endpoints in the USB device controller besides the mandatory control endpoint, where among them, four
endpoints are for IN transactions and two endpoints are for OUT transactions.
Word, half-word and byte access are all allowed for loading and unloading the FIFO. The controller features 4 DMA
channels for data transfer.
Feature
Description
Full speed (12MHz)
Generic device
4TX/2RX
Speed
Enhanced feature
Endpoint
DMA channel
Embedded RAM
4
2816
2.3.2.
MSDC
The MSDC supports
•
•
•
SD memory card specification 2.0
SDIO card specification 2.0
eMMC4.41, no booting and not support DDR mode
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MediaTek MT2625 Datasheet
There are two ports MSDC which are MSDC0, MSDC1.
Both of them can be used as the host controller of SD/SDIO/eMMC
The details feature list of MSDCx is as follow:
•
•
•
•
•
32 bit access for control registers
Built-in CRC circuit
Support PIO mode, Basic DMA mode, Descriptor DMA mode
Interrupt capabilities
Support SD/SDIO speed mode:
o
o
Default Speed mode (DS)
High Speed mode (HS)
•
•
Support eMMC speed mode:
o
o
Backwards Compatibility with legacy MMC card (DS)
High Speed SDR mode (HS)
Support 1-bit/4-bit SD/SDIO/eMMC bus width. The module is targeted at 52MHz operating clock at 1.1V
and 1.3V, and 26MHz at 0.9V. Data rates up to 52Mbps in 1-bit mode, 52 x 4 Mbps in 4-bit mode
•
•
•
•
•
Programmable serial clock rate on SD/SDIO/eMMC bus (256 gears)
Card detection capabilities (This SOC uses the EINT controller for card detection)
Do not support SPI mode for SD memory card
Do not support suspend/resume for SDIO card
Do not support eMMC boot feature
2.3.3.
SDIO2.0 Slave
MT2625 HIF module provides one SDIO2.0 card interface connected to the host and can support multiple speed
modes, which include default speed, high speed. SDIO provides high-speed data I/O with low power consumption
for mobile devices. During normal initialization and interrogation by the SDIO host, the SDIO client identifies itself
as an SDIO card. The host software obtains the card information in a tuple (linked list) format and determines if the
I/O functions of the card are acceptable to activate.
Main feature list:
•
•
•
•
•
•
•
•
Support SDver2.0 spec. Bus speed support DS or HS mode (all pins are 3.3v)
SD_CLK up to 52MHZ
Support 1-bit and 4-bits SD modes
Suppport CMD52 and CMD53
Support programmable drive strength
Support one user function
Support common interrupt (data[1])
One set DMAC is built in SDOIO Device Controller
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MediaTek MT2625 Datasheet
2.3.4.
Serial Peripheral Interface (SPI)
MT2625 chipset features two SPI master controller and one SPI slave controller to receive and transmit device data
using single, dual and quad SPI protocol. The SPI controllers can communicate at up to 52 Mbps.
The chip select signal and SPI clock of SPI master controllers are configurable. The SPI controllers also support DMA
mode for large amount of data transmission.
2.3.5.
Universal Asynchronous Receiver Transmitter (UART)
MT2625 chipset houses four UART interfaces that provide full duplex serial communication between the baseband
chipset and external devices. UART has both M16C450 and M16550A modes of operation compatible with a range
of standard software drivers.
UARTs support baud rates from 110bps up to 3Mbps and baud rate auto-detection function. Both UART1 and
UART2 provide hardware and software flow control of the RTS/CTS signals.
UARTs can configure data transfer lengths from 5 to 8 bits, with an optional parity bit and one or two stop bits by
software. They can be served by the DMA controller.
2.3.6.
Inter-Integrated Circuit Interface (I2C)
MT2625 chipset provides two I2C master controllers. There are three types of speed modes in the I2C controllers:
standard mode (100kbit/s), fast mode (400kbit/s) and high-speed mode (3.4Mbit/s), supporting 7-bit/10-bit
addressing and can be served by the DMA controller.
The I2C package size supports up to 1,024 bytes per transfer and 1,024 transfers per transaction in DMA mode and
8 bytes per transfer in non-DMA mode. START, STOP, REPEATED START conditions can be increased to support
single or multiple transfer. These features can be configured by software based on customer requirements.
2.3.7.
Pulse-Width Modulation (PWM)
There are four PWM controllers to generate pulse signals. The duty cycle, high time and low time of pulse signals
can be programmed. The PWM controllers can be configured to use 48MHz, 13MHz or 32kHz clock source to
support a wide range of output pulse frequencies.
2.3.8.
Keypad Scanner
MT2625 platform provides a keypad hardware module. The keypad supports two types of keypads: 3 x 3 single
keys and 3 x 3 configurable double keys.
The 3 x 3 keypad supports a matrix with 3*3*2 = 18 keys. The 18 keys are divided into 9 subgroups and each group
consists of two keys and a 20Ω resistor. The keypad de-bounce time is software configurable.
2.3.9.
DMA
MT2625 chipset features two DMA controllers, containing 27 channels in power down domain. They manage data
transfer between peripheral devices and memory.
There are three types of DMA channels in the DMA controller − full-size DMA channel, half-size DMA channel and
virtual FIFO DMA for different peripheral devices. DMA controllers support ring-buffer and double-buffer memory
data transactions.
To improve the bus efficiency, the DMA controllers provide an unaligned-word access function. When this function
is enabled, it can automatically convert the address format from the unaligned type to aligned type, ensuring
compliance with the AHB/APB protocol.
© 2015 - 2018 MediaTek Inc.
This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s).
Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.
Page 13 of 85
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MediaTek MT2625 Datasheet
Each peripheral device is connected to a dedicated DMA channel that can configure transfer data sizes, source
address and destination address by software. The DMA controllers can be used with the following peripherals:
•
•
•
•
•
Three I2C interfaces
Two I2S interfaces
Four UART interfaces
An USB interface
An USIM interface
2.3.10. Universal Subscriber Identity Module (USIM)
ISO/IEC 7816 is a series of standards specifying integrated circuit cards and the use of such cards for interchange.
These cards are identification cards intended for information exchange negotiated between the outside world and
the integrated circuit in the card. Because of an information exchange, the card delivers information (computation
result, stored data), and/or modifies its content (data storage, event memorization). The USIM is a device which
providing transaction between SIM card and chip.
Feature
Description
Speed
SIMCLK can be configured to 4.33MHz/3.25MHz
1ETU >= 8 CLKs
Enhanced feature
Voltage
T=0, T=1; DMA with 16 bytes FIFO; Support CLK stop mode
1.8V/3.0V
Support standard/class
Compliance to ISO/IEC 7816-3
Modem system
2.4.1.
Overview
MT2625 baseband supports 3GPP technical specification release 13 features and key features from release 14, as
listed below:
•
Release 13 features:
o
o
o
o
o
o
o
o
o
o
o
PSM
eDRX
Control Plane EPS CIoT optimization
Attach without PDN
Multi-tone Uplink
NAS Security
RoHC (Control Plane)
Idle-mode Mobility
User Plane EPS CIoT optimization (RRC connection suspension/resumption)
RoHC (User Plane)
AS Security
© 2015 - 2018 MediaTek Inc.
This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s).
Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.
Page 14 of 85
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MediaTek MT2625 Datasheet
o
o
o
o
S1-U data transfer
RRC connection re-establishment
RRC connection reconfiguration
Multi-carrier (non-anchor) operation
•
Release 14 features:
o
o
o
o
OTDOA
Two HARQ process in UL/DL
Support for maximum UL/DL TBS of 2536 bits (Cat-NB2).
RRC Re-establishment for CP data (Mobility enhancement)
2.4.2.
Block diagram
MCU
Memory Bank
Hardware
Accelerator
RFSYS
DFE
DSP
Modem
Figure 2.4-1. Block diagram
2.4.3.
Functional block description
The dataflow picture contains parts of the design.
•
Memory bank: The memory bank is used for data exchange between MCU, DSP, DFE and hardware
accelerators.
•
•
Hardware accelerators: Hardware accelerators contain engines for signal processing.
Digital front–end (DFE): DFE sends and receives data to/from ADC. It covers a filter chain (CICs/FIR), IRR
and interpolators for uplink and downlink.
•
Digital Signal Processing (DSP): The DSP is responsible for inner algorithms, including channel estimation
and synchronization.
© 2015 - 2018 MediaTek Inc.
This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s).
Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.
Page 15 of 85
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MediaTek MT2625 Datasheet
2.4.3.1.
Downlink reception
DFE samples the data sent from the ADC. DFE receives data with a source synchronous clock. The DFE will also be
the only part of the design that is aware of system time (provided from NB-IoT Timer). The system is data driven
after passing through DFE. DFE covers a filter chain (CICs/FIR), IRR and interpolators. The interpolators write data
into a time domain buffer through a port opened/closed by software, depending on system conditions.
The DSP is responsible for inner algorithms, including channel estimation and synchronization. The output is the
demodulated symbol (LLRs) to decoding engine.
2.4.3.2.
Uplink reception
MCU sends data to memory bank. The hardware accelerator is executed offline to prepare the transmitted block
and handle the symbol rate processing. Then DFE provides data to the ADC.
© 2015 - 2018 MediaTek Inc.
This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s).
Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.
Page 16 of 85
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MediaTek MT2625 Datasheet
Analog baseband
To communicate with analog blocks, a common control interface for all analog blocks is implemented. In addition,
there are dedicated interfaces for data transfer. The common control interface translates the APB bus write and
read cycle for specific addresses related to analog front-end control. During the writing or reading of any of these
control registers, there is a latency associated with the data transfer to or from the analog front-end. Dedicated
data interface of each analog block is implemented in the corresponding digital block. An analog block includes the
following analog functions for the complete analog baseband signal processing:
1) Auxiliary ADC. Provides an ADC for battery and other auxiliary analog function monitoring.
2) Clock generation. Includes PLLs to provide clock signals to MCU, I2S and USB.
3) XOSC32. A 32kHz crystal oscillator circuit for RTC applications on analog blocks.
2.5.1.
Auxiliary ADC
2.5.1.1.
Block description
5 AGPIO Channels
GPIO30~34
AVDD45_
VBATSNS
Figure 2.5-1. Block diagram
The auxiliary ADC includes the following functional blocks:
1) Analog multiplexer. Selects signal from one of the seven auxiliary input pins. Real-world messages, such as
temperature, are monitored and translated to the voltage domain.
2) 10-bit A/D converter: Converts the multiplexed input signal to 10-bit digital data.
Table 2.5-1. Auxiliary ADC input channels
Channel
Application
GPIO30~34
Thermal Sensor
VBATSNS
Input range [V]
0V to 1.4V
-40oC to 125oC
1~5
6
7
0V to 5.2V
© 2015 - 2018 MediaTek Inc.
This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s).
Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.
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