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挠性电路板微孔钻孔技术研究

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随着电子信息产品功能的不断强大,对挠性电路板高精密化提出了更高的要求,目前50μm线宽/50μm间距、75μm微孔导通已经成为挠性电路板产品的主要发展趋势,而近年来技术日益更新的高转速钻机为挠性板机械钻微孔创造了条件。本文主要研究挠性板机械钻微孔技术,通过正交实验,对辅材搭配、基材材质特性、基材铜箔类型、钻孔参数等进行了系统试验,找出影响机械钻微孔的关键因子,并通过优化钻孔参数,以达到提高微孔钻孔品质、提高钻孔效率、降低微孔制作成本的目的。

As the function of the electronic information products were increasingly stronger,it put forward higher requirements to the high-precision of the flexible printed circuit board（FPC）.At present,50μm line width, 50μm line interval and 75μm micro plating through-holes became the main trend of the development of FPC. Moreover,in recent years,the incessant updated technology of the high speed mechanical drilling rig provided conditions for the machinery micro-drilled hole of the FPCB.This paper mainly studied the technology of the machinery micro-drilled hole of the FPCB.The key influencing factor which affected the machinery micro-drilled hole were found out through the orthogonal experiment to test the auxiliary material...