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多层印制电路板凹蚀工艺的实现

更新时间:2020-05-13 12:08:16 大小:720K 上传用户:xiaohei1810查看TA发布的资源 标签:印制电路板 下载积分:3分 评价赚积分 (如何评价?) 打赏 收藏 评论(0) 举报

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在印制电路板行业,可靠性是永恒的主题,钻孔后产生的钻污对多层板的可靠性来说是致命的威胁,所以钻孔后必须有去钻污工艺将钻污去除,如果去钻污量足够大使得内层线路完全从树脂中裸露出来形成凹蚀的效果,这也就意味着钻污被完全去除,多层板之间的连接可靠性得到保证。本文着重于找出实现凹蚀的最佳工艺,以提升多层板各层连接的可靠性。

In the printed circuit board industry, reliability is the eternal theme. After drilling smear is a deadly threat to the reliability of multilayer, so after drilling there must be desmear processes to remove smear, when smear is removed enough, the inner lines will completely exposed from the resin to form the effect of etchback, which means that the smear is completely removed, the reliability of the connection between the multilayer is guaranteed. This article focuses on identify the best processes of etchback to enhance the reliability of multilayer layers connected.

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多层印制电路板凹蚀工艺的实现.pdf 720K

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