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高度集成电路在光电探测中的设计与应用
资料介绍
由于空间相机的大规模化高集成的发展，以及空间的限制，不得不进行优化设计，甚至通过特殊技术来减少电路板的面积。针对一款TDI CCD探测器的驱动电路的复杂性，基于厚膜技术将驱动电路集成在一个模块中。厚膜技术的优势在于可靠性高，设计灵活，投资小，成本低，周期短。通过厚膜集成后的模块面积减少到未集成的13。在实验中用示波器测的厚膜集成后的模块输出的信号完全满足TDI CCD探测器的需求。同时该设计对航天任务中大规模电路集成化提供了一定的参考借鉴作用。
Because of the large？scale and high？integration development for the space camera,and the limitation of space, the circuit has to be optimized,even some special technologies have to be used to reduce the area of the circuit board. In consid？eration of the complexity of driver circuit of CCD detector,the driver circuit was integrated in a module by the thick film tech？nology. There are many advantages in thick film technology such as high reliability,flexible design,low cost and short cycle. The integrated area through the thick film technology was reduced to the 1/3 area as the original circuit board before integration. The output signal of the thick film integrated module is perfect for the demand of CCD detector. A...
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| 文件名 | 大小 |
| 高度集成电路在光电探测中的设计与应用.pdf | 857K |
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