积分商城

最新搜索： 直流充电桩 16F13145 51单片机DTMF bldc w5300 rtl8370
您现在的位置是：首页 > 技术资料 > Warpage and RDL Stress Analysis
推荐星级：
  • 1
  • 2
  • 3
  • 4
  • 5

Warpage and RDL Stress Analysis

更新时间：2022-08-30 11:00:37 大小：745K 上传用户：majicblue查看TA发布的资源 标签：warpagerdl 下载积分：2分 评价赚积分 （如何评价?） 打赏 收藏 评论(0) 举报

资料介绍

As the advanced packaging technology is required to fulfill digitalized industry with big data, such as high performance computing (HPC), data center server, router, and switcher applications. Due to the hunger from above market needs, great interests were induced by both research institutes and industry. Multiple chiplets integration can provide design flexibility, high performance and power efficiency. Therefore, advanced package technology is needed for this application. Chip-last FOCoS, one of the best options, is developed as advanced packaging technology to enable different functional chiplets within a single package. This technology can improve yield,performance and cost to shorten the time to market. The package warpage control is very challenging in assembly of larger fan-out package with multi-chip integration. The redistribution layer (RDL) trace broken risk is also key issue to influence package reliability in thermal cycling test (TCT). High CTE-mismatch effect was significantly occurred at die to die (D2D) gap. The RDL trace stress is more sensitive to material properties, process flow and geometric structure due to complex multi-layer structure in several materials. It is a tougher job to minimize RDL trace stress under each process limitation. In this paper, the RDL trace stress is compared in detail to trace layout, line/spaces (L/S), D2D gap distance and trace location at room temperature (RT) and high temperature (HT). The results indicate that the trace layout design and trace location play critical roles to enhance reliability performance.

部分文件列表

文件名 大小
Warpage_and_RDL_Stress_Analysis_in_Large_Fan-Out_Package_with_Multi-Chiplet.pdf 745K

【关注B站账户领20积分】

相关下载

全部评论(0)

暂无评论
评论赚积分>>

上传资源 上传优质资源有赏金

热门标签

更多>>

最新上传

  • 打赏
  • 30日榜单

  • sd-hyc 打赏1.00元   1天前

    资料：神州易刻2024最新版

  • 柏涵 打赏1.00元   3天前

    资料：XDS100_v1_1_RTM

  • 21ic下载 打赏310.00元   3天前

    用户：jh0355

  • 21ic下载 打赏310.00元   3天前

    用户：w178191520

  • 21ic下载 打赏210.00元   3天前

    用户：gsy幸运

  • 21ic下载 打赏210.00元   3天前

    用户：zhengdai

  • 21ic下载 打赏210.00元   3天前

    用户：jh03551

  • 21ic下载 打赏110.00元   3天前

    用户：liqiang9090

  • 21ic下载 打赏60.00元   3天前

    用户：sun2152

  • 21ic下载 打赏60.00元   3天前

    用户：xuzhen1

  • 21ic下载 打赏80.00元   3天前

    用户：xzxbybd

  • 21ic下载 打赏25.00元   3天前

    用户：WK520077778

  • 21ic下载 打赏20.00元   3天前

    用户：w1966891335

  • 21ic下载 打赏20.00元   3天前

    用户：铁蛋锅

  • 21ic下载 打赏20.00元   3天前

    用户：玉落彼岸

  • 21ic下载 打赏15.00元   3天前

    用户：kk1957135547

  • 21ic下载 打赏10.00元   3天前

    用户：zpf22332

  • 21ic下载 打赏5.00元   3天前

    用户：pangpidan

  • 21ic下载 打赏5.00元   3天前

    用户：hpxny

  • 21ic下载 打赏5.00元   3天前

    用户：pandq2009

  • 21ic下载 打赏5.00元   3天前

    用户：tomp

热门下载

推荐下载

本站上的所有资源均为源于网上收集或者由用户自行上传，仅供学习和研究使用，无任何商业目的，版权归原作如有侵权，请 来信指出，本站将立即改正。

ICP许可证号：京ICP证070360号     21IC电子网 2000- 版权所有

京ICP备11013301号

京公网安备 11010802024343号