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移远EC800N 4G模块PCB封装
资料介绍
移远EC800N 4G模块PCB封装，模块封装紧凑，仅为 17.7 mm × 15.8 mm × 2.4 mm，能满足大部分 M2M 应用需求
部分文件列表
| 文件名 | 大小 |
| Quectel_EC800N-CN_Footprint&Part_V1.1/ | |
| Quectel_EC800N-CN_Footprint&Part_V1.1/Quectel_EC800N-CN_Footprint&Part_AD_V1.1/ | |
| Quectel_EC800N-CN_Footprint&Part_V1.1/Quectel_EC800N-CN_Footprint&Part_AD_V1.1/Quectel_EC800N-CN_PCB_Footprint_AD_V1.1.PCBDOC | |
| Quectel_EC800N-CN_Footprint&Part_V1.1/Quectel_EC800N-CN_Footprint&Part_AD_V1.1/Quectel_EC800N-CN_SCH_Part_AD_V1.1.SchDoc | |
| Quectel_EC800N-CN_Footprint&Part_V1.1/Quectel_EC800N-CN_Footprint&Part_Cadence_V1.1/ | |
| Quectel_EC800N-CN_Footprint&Part_V1.1/Quectel_EC800N-CN_Footprint&Part_Cadence_V1.1/Quectel_EC800N-CN_PCB_Footprint_Cadence_V1.1.BRD | |
| Quectel_EC800N-CN_Footprint&Part_V1.1/Quectel_EC800N-CN_Footprint&Part_Cadence_V1.1/Quectel_EC800N-CN_SCH_Part_Cadence_V1.1.DSN | |
| Quectel_EC800N-CN_Footprint&Part_V1.1/Quectel_EC800N-CN_Footprint&Part_PADS_V1.1/ | |
| Quectel_EC800N-CN_Footprint&Part_V1.1/Quectel_EC800N-CN_Footprint&Part_PADS_V1.1/Quectel_EC800N-CN_PCB_Footprint_PADS_V1.1.PCB | |
| Quectel_EC800N-CN_Footprint&Part_V1.1/Quectel_EC800N-CN_Footprint&Part_PADS_V1.1/Quectel_EC800N-CN_SCH_Part_PADS_V1.1.SCH | |
| Quectel_EC800N-CN_Footprint&Part_V1.1/Quectel_EC800N-CN_Footprint&Part_Revision_History.xlsx | |
| ... | |
全部评论(1)
2023-12-03 16:01:25tommy451
绝对的好东西，可以省好多时间，感谢！！！