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高速电路PCB及其电源完整性设计
资料介绍
详细分析了印刷电路板（PCB）的叠层结构设计,包括单板总层数,信号、电源及地层层数,尤其是信号、电源及地层的相对位置排列。具体研究了PCB的电源完整性设计,分析了高速电路中的电源分配网络（PDN）结构,得出PCB设计中可能影响电源完整性设计的因素。基于这些因素,进行了仿真分析,仿真结果验证了PCB电源完整性设计的可行性与合理性。
The design of stacked structure for printed circuit board（ PCB） is analyzed in detail,including total layer number of single board,layer numbers of signals,power supply and grounding,especially the relative arrangement position of signal,power and grounding layers. The integrity design of power supply for PCB is researched in detail. The structure of power delivery network（ PDN） of high speed circuit is analyzed,the factors may affect the integrity design are obtained. Based on these factors,the simulation analysis is conducted; the results verify the feasibility and rationality of the integrity design of power for PCB.
部分文件列表
| 文件名 | 大小 |
| 高速电路PCB及其电源完整性设计.pdf | 533K |
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