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MCVD法制作玻璃电路板的过程及相关的性能分析

更新时间:2020-10-27 01:55:50 大小:2M 上传用户:gsy幸运查看TA发布的资源 标签:mcvd电路板 下载积分:1分 评价赚积分 (如何评价?) 打赏 收藏 评论(0) 举报

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文章详细讲述了用MCVD法制作玻璃线路板的过程及相关的性能分析,并叙述了玻璃基材与样品板测试/评估。事实上,测试结果表明用MCVD法制作的玻璃线路板能在(-55~850)℃范围内长期使用具有优异的热可靠性和导电性能,完全适合于强电、弱电PCB行业和大功率LED封装。

This paper introduced preparative process of glass printed circuit board with multi-beam chemical vapor deposition method and its functional analysis in details. Because those parameters are related to finished electronic products’ function and usage, this paper described the test valuation from sample board test and valuation. In fact, the test result showed that glass printed circuit boards can bear long-term usage from-55~850 ℃ with excellent thermal credibility and electrical function with multi-beam chemical vapor deposition method, which is completely suitable for forceful electricity and weak electricity’ PCB fields as well as heavy power light emitting diode assembly.

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MCVD法制作玻璃电路板的过程及相关的性能分析.pdf 2M

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