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柔性银包铜基导电线路的制备与性能
资料介绍
针对导电银浆价格高、导电铜浆易氧化等问题,采用银包铜粉作为导电填料,聚氨酯改性丙烯酸树脂为树脂基体,通过丝网印刷在聚酰亚胺薄膜上印制导电线路,并用热固化的方式进行固化,从而获得导电性能优良的柔性银包铜基导电线路。结果表明:当银包铜粉的含量为65%(质量分数)时,制备的导电胶各项性能达到最佳值,满足丝印要求,平均膜厚为29.25μm,固化后得到的导电膜电阻率达到最低值1.06×10^-3Ωcm。
Due to the dilemma of costly silver paste and vulnerable copper paste,silver-coated copper powders in polyurethane modified acrylic resin were prepared.Flexible and conductive circuits were then obtained by screen printing on polyimide film and heat curing.The results show that the optimal filler content of silver coated copper powder is 65%(mass fraction),which meets the requirement of silk screen printing with average film thickness of 29 25μm.The resistivity of the conductive film after curing reaches the lowest value of 1 06×10-3Ωcm.
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| 文件名 | 大小 |
| 柔性银包铜基导电线路的制备与性能.pdf | 7M |
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