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印制电路板用大直径钻头的钻尖优化设计
资料介绍
随着现代电子产品的飞速发展,对起到层间互联作用的印制电路板的加工质量要求越来越高。大孔径在加工过程容易出现各类缺陷,钻头缠丝现象是工程师遇到的最棘手问题。本文通过对三种不同钻尖设计的大直径钻头进行试验与研究,分别从刀具磨损和缠丝现象等方面进行考察,验证出一种最优的钻尖设计方案之一,从而有效解决了大直径钻头的钻孔缠丝现象。
With the rapid development of modern electronic products,the processing quality of printed circuit boards that play a role in layer interconnections has become increasingly stringent.The large hole process are prone to various types of quality defects,and the tangling phenomenon of drill bits is the thorniest problem encountered by engineers.In this article,three large-diameter drill bits with different drill tip designs are tested,and the tool wear and the wrapping phenomenon are examined,and an optimal drill tip design to effectively solve wrapping problem of large-diameter drill bits is found and verified.
部分文件列表
| 文件名 | 大小 |
| 印制电路板用大直径钻头的钻尖优化设计.pdf | 1M |
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