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基于专利计量的集成电路制造技术创新能力分布研究
资料介绍
通过建立集成电路制造技术领域分类体系,确定专利信息检索策略,对德温特专利数据库进行专利信息下载、清理,采用专利计量方法,分析了1974—2013年全球集成电路制造各技术领域专利的时间分布特征,探讨了各技术领域的创新发展趋势;通过"专利地位—专利质量"二维分析矩阵比较分析了集成电路制造各技术领域美国、日本、中国所处的地位.研究发现,中国在集成电路各技术领域的创新能力与美、日等领先国家均有较大差距,未来在重点推动封装技术、退火技术、平坦化工艺3个技术领域创新发展的同时,还应加强对先进技术的引进、消化、吸收、再创新.最后,提出了今后中国集成电路制造重点技术发展方向的若干建议.
It firstly designed the technology classification system and search strategy for the identification of integrated circuit (IC) manufacturing. Then, the temporal distribution characteristics of various technical fields of IC manufactur- ing were analyzed by using the Derwent Innovations Index (DII) patent data authorized from 1974 to 2013, and their future development trends were also discussed. Based on the "patent position - patent quality" two-dimensional analysis matrix, it studied the positions of major countries ( USA, Japan, and China) in various technical fields. The results show that there is a great disparity between China and the leading level...
部分文件列表
文件名 | 大小 |
基于专利计量的集成电路制造技术创新能力分布研究.pdf | 555K |
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