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红外热像仪硬件通讯电路的设计与实现

更新时间：2020-08-02 05:29:10 大小：835K 上传用户：守着阳光1985 查看TA发布的资源 标签：红外热像仪 下载积分：5分评价赚积分（如何评价?）收藏评论(0) 举报

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摘要：设计并实现了基于红外热像仪图像处理板FPGA模块的硬件通讯电路，该电路采用串行通讯和FIFO读写方式。通讯电路一方面接收上位机的控制数据并实时应答反馈，一方面将通过FIFO与图像处理板的DSP模块实时进行控制信息交互，从而形成各模块问的双向通讯链路。该设计避免了传统图像处理板采用专用串行通讯芯片，如TL16CP754等，将该芯片功能通过FPGA实现，节省了面积与成本，提高了系统集成度和稳定性，利于系统的小型化、低成本发展。仿真与实验结果均表明，该设计合理，系统工作稳定。

@@@@Hardware communication circuits based on field-programmable gate array (FPGA) module on im?age processing boards of infrared thermal imaging systems are designed and implemented. Serial communication and first-in-first-out (FIFO) reading and writing modes are used in the circuits. On one hand, control data from PC are received and replied in real time by communication circuits. On the other hand, control information interchange is performed through FIFO and data signal processor (DSP) module on image processing boards to form bidirection?al communication links among modules. Special serial communication chips such as TL16CP754 used on tradition?al image processing boards are not adopted in the de...