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电路板电子元器件拆卸技术研究进展
资料介绍
电路板元器件的拆卸包括两个阶段:热力解焊和机械拆除。依据电路板组装的方法,拆卸类型分为选择性拆卸和一次性拆卸。国外的拆卸技术大量依靠自动识别方法,具有较高的自动化。我国的拆卸技术大部分为半自动化的拆卸,一次性拆解之后,采用人工进行分类元器件。
The disassembly technology of electronic component on printed circuit board consists of two stages: desoldering and mechanical removal. Selective disassembly andsimultaneous disassembly are the main methods at present time. Disas- sembly technology abroad depends on the automatic recognition selecting component. Whereas technology in China is semi - automatic disassembly, which still needs labor selection.
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文件名 | 大小 |
电路板电子元器件拆卸技术研究进展.pdf | 294K |
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