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印制电路板电镀线节水控制研究
资料介绍
文章通过分析我公司印制电路板电镀线溢流、补水方式以及水质特征，通过建立溢流补水模型获取最佳补水方式。并且从减少带水量带出与回用两方面来减少用水。通过技术手段真正实现从源头进行用水控制。
In this paper, the water quality characteristics of overflow and water quality were analyzed. The optimal hydration method was obtained by setting up the overflow water supply model. And reducing water using by reducing the amount of water were taken out and recycled, which achieved source control by technological means.
部分文件列表
| 文件名 | 大小 |
| 印制电路板电镀线节水控制研究.pdf | 312K |
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