- 1
- 2
- 3
- 4
- 5
基于EMC的高速PCB设计
资料介绍
在高速电路系统中,过高的系统工作频率将产生传输线效应和信号完整性问题,使得基于传统方法设计的印刷电路板达不到系统电磁兼容性要求。本文主要分析了高速电路板设计中遇到的电磁兼容问题,从电源系统、信号线的传输线效应、电路间的串扰效应、电路间的串扰和电磁辐射干扰四个方而进行阐述,分析其原理并提出了解决办法。
For high-speed Electric Circuits, the excessively high frequency will have the problem of the transmission line effect and signal completion. It makes the high speed PCB designed with traditional method no to meet the electromagnetic compatibility requirements. The basic EMC problems of high peed board design were analyzed. The principles were illuminated and some design techniques were introduced in view of power system, transmission line effect of signal lines, crosstalk among circuits and electromagnetic interference.
部分文件列表
文件名 | 大小 |
基于EMC的高速PCB设计.pdf | 212K |
相关下载
- 华为模块电源管理设计指导-(V100R001_02 Chi...
- 华为LGA模块PCB设计指导_V2.0_20150126.pdf
- HUAWEI Module USB Interface Descriptor Gui...
- HUAWEI ME909s-821 LTE LGA模块硬件指南V100R...
- HUAWEI ME909s-821 LTE LGA Module Acceptanc...
- HUAWEI 30 mm x 30 mm LGA Module Hardware M...
- HUAWEI 30 mm x 30 mm LGA Module Developmen...
- Altium_Designer_规则设置三例.pdf
- STM32F407产品技术培训-DSP库及其例程
- STM32F407产品技术培训-2.浮点单元.pdf
全部评论(0)