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大尺寸BGA封装器件振动加固技术研究
资料介绍
通过理论分析，总结了BGA器件的振动疲劳故障机理及其寿命计算方法；通过典型BGA器件振动故障的金相分析，总结了振动故障的焊点分布和裂纹形式特点；通过归纳经验，总结了大尺寸BGA焊点耐振动环境的加固技术。
Based on the theory analysis,the mechanism of vibration fatigue failure of BGA solder joint and its life calculation method were summarized.Through metallographic analysis of typical vibration fault of BGA solder joint,the fault distribution and the characteristics of cark form were summarized.Through summing up experience,the Anti vibration strengthening technology of big size BGA solder joint were summarized.
部分文件列表
| 文件名 | 大小 |
| 大尺寸BGA封装器件振动加固技术研究.pdf | 585K |
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