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金带键合印制电路板加固措施研究
资料介绍
对印制电路板(PCB)上键合的金带在高力学响应下断裂问题的机理进行研究,通过建立力学模型并开展工艺试验验证,得到一种工艺加固措施,有效地解决了金带断裂的问题,并将分析方法和措施推广到漆包线等其他柔性互连方式中,为航天产品的高可靠性互连提供了解决方案。
The mechanism of the fracture of the gold ribbon bonding under the high mechanical response on the PCB has been investigated. Through the establishment of mechanical model and the verification of process experiment,a process strengthening measure has been proposed,which can effectively prevent the problem of fracture of gold ribbon bonding. Furthermore,the analytical methods and measures have been extended to other flexible interconnection methods,such as enamelled wire,which provides a solution to the high reliable interconnection in the aerospace product.
部分文件列表
| 文件名 | 大小 |
| 金带键合印制电路板加固措施研究.pdf | 426K |
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