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弹上用驱动器电路板热仿真分析及试验研究
资料介绍
弹上用驱动器电路板工作于大气层外真空状态下,环境温度为-45℃~60℃。考虑环境的恶劣性,且弹上用驱动器工作时产生的热量,为保障印制电路板(PCB)元器件处于正常工作的温度范围,进行有效的热仿真研究十分必要。本文对某型弹上用驱动器的PCB电路板进行建模,利用以计算流体动力学(CFD)为核心的热仿真软件Icepak,分别进行常温常压及真空环境下的热仿真分析,并通过红外测温仪对常温常压下的弹上用驱动器进行了温度实测的试验验证,不仅验证了本PCB板模型的准确性,通过仿真分析还得出,各元器件的最大温度都在允许的工作范围内,验证了某型弹上用驱动器电路板热设计的合理性。为高可靠性、多功能、高集成、适应性强的电路板开发提供了有力保障。
Driver circuit board on the missile works in the atmosphere under vacuum where the ambient temperature is between-45~60℃. Due to the harshness of the environment and the generating heat by working, it is necessary to carry out effective thermal simulation research to ensure that the PCB components are in the normal working temperature range. This article built the board level PCB model, and utilized thermal simulation software icepak centered on CFD to perform thermal simulation of PCB in vacuum. The simulation results obtained the temperature change and the highest temperature of each component and all the temperature are normal which verified the rationality of thermal design. According to the result, we can perform component layout adjustment to improve reliability of the PCB.
部分文件列表
| 文件名 | 大小 |
| 弹上用驱动器电路板热仿真分析及试验研究.pdf | 3M |
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