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印制电路板拼板中测试图形位置设计改进

更新时间:2020-10-25 20:26:45 大小:1M 上传用户:gsy幸运查看TA发布的资源 标签:印制电路板 下载积分:2分 评价赚积分 (如何评价?) 打赏 收藏 评论(0) 举报

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介绍一种实现在同一电路板上将测试板和生产板合二为一方法,其特点是直接将测试图形转移到量产板的工艺边上,大幅提高整个拼板的利用率;同时测试图形还可分布在不同小单元的工艺边,实现最小单元图形的精确测试,大幅保障产品的良率;此外进行测试取样时,不会破坏成型区的出货单元,大幅减少报废率;可同时满足客户出货测试和印制板制作测试的两者同步检测,避免相关品质纠纷的发生。

This paper introduces a method is realizing the integration of test board and production board on the same circuit board. Its characteristic is to cancel the original design of test board and transfer the test pattern of test board directly to the process edge of production board which greatly improves the utilization rate of the material. At the same time, the test pattern can also be used. Distributed in the process side of different small units, the accurate testing of the minimum unit graphics is realized, which greatly ensures the yield of the product. In addition, when testing and sampling, it will not destroy the delivery unit in the forming area and greatly reduce the scrap rate. It can also satisfy the synchronous testing of both customer delivery test and PCB production test, and avoid the occurrence of related quality disputes.

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印制电路板拼板中测试图形位置设计改进.pdf 1M

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