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集成电路纯锡电镀锡渣锡片问题探讨
资料介绍
纯锡电镀过程中产品产生的锡片、锡渣是经常会遇到的问题,由于锡片、锡渣的产生是随机的且体积较小、外观颜色和镀层相近,因此生产过程中较难发现;同时锡片和锡渣的存在会造成产品的短路和电性能不良,使用过程中会造成电路烧坏和功能不稳定等问题;结合理论及实际生产过程分别对纯锡电镀过程中的锡片和锡渣产生的原因进行了讨论,并针对其原因从硬件升级和过程控制两个方面对锡片、锡渣问题的解决提出了改善建议。
Tin residue and sheetis a frequent issue during pure tin plating process.Because of tin residue and sheet have the similar color totin layer and have avery small body,so it is difficult to be discovered.At the same time,tin residue and sheet can lead to short and electrical property unstable.This thesis discussed the reasons of tin residue and sheet issues during the Pure Tin Plating process,and aimed at the reasons,proposed some improvement ideas about the problem from hardware improvement and process control.
部分文件列表
| 文件名 | 大小 |
| 集成电路纯锡电镀锡渣锡片问题探讨.pdf | 1M |
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