推荐星级：
- 1
- 2
- 3
- 4
- 5
某单片微波集成电路漏电问题分析
资料介绍
对某单片微波集成电路上机工作17个月后在客户端使用时频响不良的原因进行了研究。利用外观检查、X-ray测试、I-V特性曲线测试和声学扫描检查等手段对该单片微波集成电路的失效原因进行了具体的分析。通过测试发现样品的失效模式为漏电,内部芯片表面可见钝化层破损,因此推测样品失效与ESD损伤或沟道退化有关。
The causes of bad frequency response of a MMIC when it is used in the elient after 17 months of operation are studied.By means of appearance inspection,X-ray test,I-V characteristic curve test and acoustic scanning inspection,the failure reasons of the MMIC are analyzed in detail.Through test,it is found that the failure mode of the sample is leakage,and the passivation layer of the inner chip surface is damaged.Therefore,it is speculated that the failure of the sample is related to ESD damage or channel degradation.
部分文件列表
| 文件名 | 大小 |
| 某单片微波集成电路漏电问题分析.pdf | 26M |
相关下载
- 华为模块电源管理设计指导-(V100R001_02 Chi...
- 华为LGA模块PCB设计指导_V2.0_20150126.pdf
- HUAWEI Module USB Interface Descriptor Gui...
- HUAWEI ME909s-821 LTE LGA模块硬件指南V100R...
- HUAWEI ME909s-821 LTE LGA Module Acceptanc...
- HUAWEI 30 mm x 30 mm LGA Module Hardware M...
- HUAWEI 30 mm x 30 mm LGA Module Developmen...
- Altium_Designer_规则设置三例.pdf
- STM32F407产品技术培训-DSP库及其例程
- STM32F407产品技术培训-2.浮点单元.pdf
全部评论(0)