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应用于便携式激光雷达测距仪的单芯片全集成前置放大电路系统
资料介绍
基于0.5μmCMOS工艺,设计了一款应用于便携式激光雷达测距仪的单芯片全集成前置放大电路系统。该芯片主要由前置跨阻放大器(TIPA),差分电压放大器(DVPA),带隙基准源和其它接口电路构成。其中如何设计最适用于激光雷达测距信号处理系统的前置跨阻放大器和差分电压放大器是文中重点关注的对象。测试结果表明,该芯片的跨阻增益可达87.27dBΩ,-3dB带宽952.8MHz,输入等效参考噪声电流17.64pA/Hz1/2。。芯片面积为2.816mm2(包括焊盘面积),功耗为106.9mw,其中输出缓冲级功耗占75%。
A monolithic front-end amplifier for portable laser rangefinder was realized in 0.5μm CMOS technology, owing to attaining adequate performance and lower cost simultaneity. It consists of transimpedance pre-amplifier (TIPA), differential voltage post-amplifier (DVPA), band gap reference and other interface circuits. Attention has been paid to design the TIPA and DVPA, which are most appropriate for the laser rangefinder signal processing. The measurement results show that the chip achieves 87.27 dBΩ transimpedance, 952.8 MHz bandwidth, 17.64 pA/Hz^1/2 input referred noise current. The die area occupies 2.816 mm2 including pads and dissipates 106.9 mW power consumption with 75% from ...
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文件名 | 大小 |
应用于便携式激光雷达测距仪的单芯片全集成前置放大电路系统.pdf | 818K |
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