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印制电路板工艺涂层防湿热防霉菌防盐雾试验标准的对比与分析
资料介绍
本文对现有标准中印制电路板工艺涂层的防湿热、防霉菌、防盐雾试验方法进行了对比，分析了各标准在标准试样制备、试验依据方法及表征参数等方面的要求，对比分析结果可为印制电路板工艺涂层三防性能验证试验方案设计提供指导。
Moisture Proof, Fungus Proof and Salt Fog Proof （Three-Proof） test methods refers to existing standards of printed circuit board （PCB） were compared in a manner in this paper, simultaneously, analyzed each standard＇ s requirements to standard specimen preparation, test method and characterization parameter. Comparing and analyzing result of this work can provide guidance for engineers who are planning to design a test scheme in order to validate Three-Proof performance of PCB coating.
部分文件列表
| 文件名 | 大小 |
| 印制电路板工艺涂层防湿热、防霉菌、防盐雾试验标准的对比与分析.pdf | 245K |
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