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印制电路板制造关键技术概述

更新时间:2020-06-20 06:52:21 大小:185K 上传用户:IC老兵查看TA发布的资源 标签:印制电路板 下载积分:5分 评价赚积分 (如何评价?) 收藏 评论(0) 举报

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印制电路板是电子元器件电气连接的提供者,已有100多年的历史。按照线路板层数,印制电路板可分为单面板、双面板、四层板、六层板以及其他多层线路板。发展到今天,印制电路板已经达到相当精细的程度,且许多改进和优化电路板的技术也陆续诞生。文章主要概述目前使用的印制电路板制造的关键技术,主要包括高密度互连电路板、高密度任意层互连电路板、集成印制电路板、高散热金属基板、高频高速印制电路板和刚挠印制板制造的关键技术。

The printed circuit board is to provide electrical connection of electronic components. It has developed for more than 100 years. According to the number of circuit board, printed circuit board can be divided into single panel,double plate, four plates, six plates and other multi-layer circuit board.Until today, the printed circuit board has reached a fairly fine degree. Many improvements and optimization of circuit board technology has been born. This paper provides an overview of the current use of printed circuit board manufacturing technology, including high density interconnect circuit board, high density interconnect arbitrary layer circuit board, and integrated printed circuit board, high heat dissipation the metal substrate, hig...

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印制电路板制造关键技术概述.pdf 185K

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