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cadence-layout教程
资料介绍
Internal analysis
Because the distance from the middle of the circuit is often close to each other, you can see the Interconnect coupling.
Since all the components of the fine mold road are located on the same substrate, the Yasushi may be able to pass through the substrate coupling of the other substrate.
Since the power supply of the Kushiro is like the image speed of the gold bureau to the wafer, the value of the dissipative inductance of the metal complex will make the current deuterium rust-resistant electric seat lower the seat of the Yadian video alarm circuit (IR drop induced). Power/ground bounce)
可靠性分析
在一般的模授中懂验登霉路的功能及特性，但電路的電晶避及速接象在正常的工作下食出现老化等性能衰退现象，将影馨精微電路工作的奇命。
影等电品雅工作特性的因素：antenna effect，holt-carrier effect，oxide breakdown等
影等速接象特性的效息：electron migration，strss migration可靠性分析需要建立元件或速接象的老化模型
提供足约的工作愿周腐提升電路可靠度的最直接方法。
部分文件列表
| 文件名 | 大小 |
| cadence-layout教程.pdf | 3M |
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