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BIWIN qNAND Specification eMMC5.0 TLC 3D NAND
资料介绍
BIWIN qNAND is an embedded flash storage designed in the form of LFBGA package, using MMC protocol V5.0 interface. It combines advanced NAND flash and intelligent flash controller in single package, offering excellent performance and high reliability storage solution to embedded applications. With industry standard eMMC5.0 protocol.
部分文件列表
| 文件名 | 大小 |
| BIWIN_qNAND_Specification_eMMC50-T_V1(BWCTGSC21G32G).pdf | 1M |
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